Rapid method for evaluation of cure kinetics of thermoseting polymers
DOI:
https://doi.org/10.20450/mjcce.2013.303Keywords:
thermosetting resins, curing reaction, DSC, kinetics parametersAbstract
Abstract
In this study we report the results of a rapid method applied for evaluation of the data obtained by DSC measurements of cure reaction of thermosetting resins. The method is based on Borchardt and Daniels kinetic model and enables determination of basic parameters important for product and process development, but also for optimization of cure cycles for variety of thermosets.
References
References
D.K. Platt, Engineering of High Performance Plastics, Rapra Technology Limited, UK, (2003).
V.Mittal, High Performance Polymers and Engineering Plastics, Wiley, (2011).
T. Kamon, H. Furukawa., Curing mechanisms and mechanical properties of cured epoxy resins, Adv. Polym. Sci. 80, 173-202 (1986).
M.P Sepe, Thermal Analysis of Polymers, Rapra Technology 8, 11 (1997).
H.J.Borchardt and F.J. Daniels, Analysis of DSC kinetics, Am. Chem.Soc. 79, 41-46 (1957).
T. Ozawa, Kinetic analysis of derivative curves in thermal analysis, J. Therm. Anal. 2, 301-324 (1970).
A. A. Duswalt, The practice of obtaining kinetic data by differential scanning calorimetry, Thermochim. Acta. 8, 57-68 (1974).
P. I. Karkanas, I. K. Partridge and D. Attwood, Modelling the cure of a commercial epoxy resin for application in resin transfer moulding, Polym. Int. 41, 183-191 (1996).
B. Ellis, In Chemistry and Technology of Epoxy Resins, Ed. B. Ellis, Blackie, Glasgow, (1993).
Q.Y. Liu, J.B. Chen, S.M Liu, J.Q. Zhao, Dynamic cure kinetics of epoxy resins using an amine-containing borate as a latent hardener, Polym. Int. 61, 959-965 (2012)
